Diamond Cmp Pad Conditioner

Detailed Product Description

Diamond Cmp Pad Conditioner

Application: The dressing of polishing pad for silicon wafer

Φ20*7.3T
Φ108*6.6T

Features:
         1. The single layer brazing technics make the chemical bond between diamond and brazing metal, ensure of the hold of diamonds.
         2. High exposure proportion and uniformity of diamonds achieve high working efficiency.
         3. Diamonds with ordered matrix
         4. Long lifetime
         5. Good planeness
         6. Various coatings for different CMP conditions