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Contact Us
- Contact Person : Ms. Wen Rainy
- Company Name : Ashine Diamond Tools Co., Limited
- Tel : 0086-592-5688122
- Fax : 0086-592-5688000
- Address : Fujian,XIAMEN,XIANGYU ROAD #88
- Country/Region : China
- Zip : 361006
SILICON WAFER GRINDING WHEEL
Product Detailed
Related Categories:Tool Parts
Detailed Product Description
SILICON WAFER GRINDING WHEEL
Size: 4",6",8",12"
SEGMENT: continous, segmented
Vitrified bond: Rough grinding A combination fo high rigidity vetrified bond and large grit diamond are
employed to achieve stable grinding process, even for wafers tat are layered with oxide or nitride.
Resin bond: fine grinding, little damage for workpieces, provide stable grinding .
Application: Silicon and compound semiconductor wafer, etc
Features:
1.Long life.
2. Require less wheel dressing .
3. efficient-cost
4. Extremely low depth of sub-surface damage
5. reduced grinding resistance
