Hub less Ultra-Thin Diamond Blade

Detailed Product Description

Hub less Ultra-Thin Diamond Blade

Metal bond:  suitable for hard and thick materials
Resin bond: suitable for fragile and thin materials
Electroformed bond: super cutting quality, long blade life.

thickness 0.1mm-0.3mm

Application:
1. Wafers/crystals
2. Semiconductor package
3. Glass/quartz/sapphire
4. Printed board
5. Ceramics

Features:
1. High precise cutting performance, With improved conditioning of the lateral face of the blade, surface chipping and slant cuts are minimized.
2. High working efficiency
3. Less heat-affection than laser cutting
4. long lifetime, reduce cost
5. smooth and regular kerf